Electrokinetic optimization of a micromixer for lab-on-chip applications

  • Dominik P.J. Barz (Author)
  • Hendryk Bockelmann (Author)
  • Vincent Heuveline (Author)
    Engineering Mathematics and Computing Lab (EMCL), Interdisciplinary Center for Scientific Computing (IWR), Heidelberg University

Abstract

This paper is concerned with the optimization of an electrokinetic micromixer suitable for Lab-on-Chip and other microfluidic applications. The mixing concept is based on the combination of an alternating electrical excitation applied to a pressure-driven base flow in a meandering microchannel geometry. The electrical excitation induces a secondary electrokinetic velocity component which results in a complex flow field within the meander bends. A mathematical model describing the physicochemical phenomena present within the micromixer is implemented in an in-house Finite-Element-Method code. We first perform simulations comparable to experiments concerned with the investigation of the flow field in the bends. The comparison of simulation and experiment reveals excellent agreement. Hence, the validated model and numerical schemes are employed for a numerical optimization of the micromixer performance. In detail, we optimize the secondary electrokinetic flow by finding the best electrical excitation parameters, i.e. frequency and amplitude, for a given waveform. The simulation results of two optimized electrical excitations featuring a discrete and a continuous waveform are compared and discussed. The results demonstrate that the micromixer is able to achieve high mixing degrees very rapidly.

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The Engineering Mathematics and Computing Lab (EMCL), directed by Prof. Dr. Vincent Heuveline, is a research group at the Interdisciplinary Center for Scientific Computing (IWR).

The EMCL Preprint Series contains publications that were accepted for the Preprint Series of the EMCL and are planned to be published in journals, books, etc. soon.

The EMCL Preprint Series was published under the roof of the Karlsruhe Institute of Technology (KIT) until April 30, 2013. As from May 01, 2013 it is published under the roof of Heidelberg University

Published
2012-07-01
Language
en