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doi:10.22028/D291-35722
Titel: | The Simulated Effect of Adding Solder Layers on Reactive Multilayer Films Used for Joining Processes |
VerfasserIn: | Yuile, Adam Schulz, Alexander Wiss, Erik Müller, Jens Wiese, Steffen |
Sprache: | Englisch |
Titel: | Applied Sciences |
Bandnummer: | 12 |
Heft: | 5 |
Verlag/Plattform: | MDPI |
Erscheinungsjahr: | 2022 |
Freie Schlagwörter: | CFD thermal simulation analysis reactive multilayer systems joining |
DDC-Sachgruppe: | 500 Naturwissenschaften |
Dokumenttyp: | Journalartikel / Zeitschriftenartikel |
Abstract: | In order to introduce new bonding methods in the area of electronic packaging a theoretical analysis was conducted, which should give substantial information about the potential of reactive multilayer systems (rms) to create sufficient local heat for joining processes between silicon chips and ceramic substrates. For this purpose, thermal CFD (computational fluid dynamics) simulations have been carried out to simulate the temperature profile of the bonding zone during and after the reaction of the rms. This thermal analysis considers two different configurations. The first configuration consists of a silicon chip that is bonded to an LTCC-substrate (Low Temperature Co-fired Ceramics) using a bonding layer that contains an rms and a solder preform. The reaction propagation speed of the reactive multilayer was set to a value of 1 m/s, in order to partially melt a solder preform underneath a silicon chip. The second configuration, which consists only of the LTCC substrate and the rms, was chosen to study the differences between the thermal outputs of the two arrangements. The analysis of the CFD simulations was particularly focused on interpretations of the temperature and liquid fraction contours. The CFD thermal simulation analysis conducted contains a melting/solidification model which can track the molten/solid state of the solder in addition to modelling the influence of latent heat. To provide information for the design of a test-substrate for experimental investigations, the real behaviour of Pt-100 temperature probes on the LTCC-substrate was simulated, in order to monitor an actual bonding in the experiment. All simulations were carried out using the ANSYS Fluent software. |
DOI der Erstveröffentlichung: | 10.3390/app12052397 |
Link zu diesem Datensatz: | urn:nbn:de:bsz:291--ds-357229 hdl:20.500.11880/32567 http://dx.doi.org/10.22028/D291-35722 |
ISSN: | 2076-3417 |
Datum des Eintrags: | 11-Mär-2022 |
Fakultät: | NT - Naturwissenschaftlich- Technische Fakultät |
Fachrichtung: | NT - Systems Engineering |
Professur: | NT - Prof. Dr. Steffen Wiese |
Sammlung: | SciDok - Der Wissenschaftsserver der Universität des Saarlandes |
Dateien zu diesem Datensatz:
Datei | Beschreibung | Größe | Format | |
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applsci-12-02397.pdf | 5,39 MB | Adobe PDF | Öffnen/Anzeigen |
Diese Ressource wurde unter folgender Copyright-Bestimmung veröffentlicht: Lizenz von Creative Commons